報告書番号

T02009

タイトル（和文）

高出力密度熱電変換システムの開発（その2） -大型熱源への適用性の検討-

タイトル（英文）

Development of the Intensive Energy Density Thermoelectric Energy Conversion System (2)Application to the Industrial Heat Source

概要 （図表や脚注は「報告書全文」に掲載しております）

熱電変換素子に大きな熱流束を与えかつ脆弱な素子への熱応力を緩和するＦＧＭ（傾斜機能材料）コンプライアント・パッド1）(以下CPと略す)、非接合型コンプライアントCPおよびリキッドCPを発明し、これよる出力密度の向上および耐久性向上による発電単価低減の見通しを得た。FGM CPおよび非接合型CPを備える熱電変換モジュールは、従来型に比べ1.8倍の温度差を負荷でき（図１）、これにともない素子の変換効率が1.7倍に向上するため、従来型に比べ3倍の出力が得られることが推定できる。

概要 （英文）

To achieve high thermal energy density in thermoelectric (TE) power conversion systems, conductively coupling the TE module to the hot and cold heat exchangers is the most effective configuration. This is accomplished by two sets of FGM compliant pads (CP) combined with bond-free compliant pad or liquid CP inserted between the TE cells and hot/cold heat exchanger ducts. The bond-free CP is made of porous material in which braze filler material is infiltrated. If heated over the melting temperature of the braze filler, thermal gap conductance of the interface would be enhanced due to strong affinity of the braze filler with adjacent member. Sliding of this interface is possible so long as the braze filler is liquid. The liquid CP is composed of a 塗ichbathtub媒 in which liquid braze filler is comprised. In case of BiTe TE system, tin (Sn) is adopted as braze filler material. Because the melting temperature of Sn is 232℃, it is liquid during operating temperature. Due to strong affinity of Sn with Cu, the thermal gap conductance of Cu/Sn/Cu interface is enhanced, while displacement of this interface is possible because Sn is liquid. Therefore differential thermal expansion of the hot and cold ducts parallel to the duct surface can be relieved perfectly. Vibration of the ducts normal to the duct surface is also accepted. The TE unit with FGM CP and bond-free CP could produce electrical power three times as much as conventional one.

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